300mm wafer cassette-less cleaning system
Achieved high purity of 65nμm / 5 pieces! Inserted 25 pieces into the gaps of 25 Wf to create a half pitch and processed 50 pieces at once.
The "300mm Cassette-less Wafer Cleaning System" is a product used in the chemical polishing process after final polishing. It processes 50 wafers at a time by placing 25 wafers in the gaps of 25 wafers in a half-pitch arrangement, achieving a high cleanliness level of 65nμm/5 pieces. 【Main Specifications】 ■ Items to be cleaned: 300mm thickness 0.75t ■ Processing method: Cassette-less dip processing ■ Processing speed: 50 pieces/5 min (variable) ■ Cleanliness inside the device: 0.1μm Class 1 ■ Pass line: FL+900±5mm manual set with a hoop ■ Transport method: Front transport *For more details, please refer to the PDF document or feel free to contact us.
- Company：ダン科学
- Price：Other
